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Our Services:

R&D center

We will support R&D outsourcing for our customers including HW/SW embedded project and mechanical design.

Our engineers will support the project from the first idea till final drawing and production.


Full Turn-Key projects and boards assmbly.





Wire bonding:

Wire bonding assmbly on PCB/Flex PCB .







Fab Servises:

GaAs , SiGe up to 8''









Full Turn-key
coils windings abiliteas
Micro electronica assmbly
Manufacturing unique RFID tags
Wire bonding abilities
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